BGA-IC Adhesive Remove Liquid, High-effect
For the mobile phone BGA/IC Resin sealant
Softened and removed, Scientific formula
Does not hurt the Motherboard or Component
RL-039 can quickly soften Resin
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Shipping & Handling-
If Your placing a Order Your order will be in Process Immediately & on Same Day You will get
Tracking order on your whats-app or on your Email at Evening 7.00 pm to 9.00 pm
Delivery Time–
In City & Town Area it will Take approx 5 to 6 days, Village or Rural Area it will take approx 7 to 8 days
Note – If you want enquirer about Delivery you can Whats App Us On This Number – 9967040744
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