RELIFE CP-002 Multi Purpose Glue 50ml Black Gel
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- RMA-223 Is a Moderately Active Rosin-Type Solder Paste , Which Is Widely Used In The SMD Rework Process Of Mobile Phone Boards
- For The No-Clean Solder Paste , The Color Of Residue Is Very Light And Has Very High SIR Value, It Is Recommended For BGA , CSP And Other Ball Array Solder Joint Rework And Ball Replacement
BGA-IC Adhesive Remove Liquid, High-effect
For the mobile phone BGA/IC Resin sealant
Softened and removed, Scientific formula
Does not hurt the Motherboard or Component
RL-039 can quickly soften Resin
Widely used,suitable for electronic products/mobile phones/crystal jewelry/leather/clocks, etc.
Needle mouth design, save environmental protection, no waste, no clogging
High-strength adhesion,brushing effect is good
- Special Glue For Laptop / Mobile Phone LCD, Touch, Folder Changing, Bezels, Gorilla Glass Lens
- T7000 GLUE Appearance – BLACK semi floating body | solid content – 30% – 35% | After curing hardness – 65- 80A | Surface drying time – 3 minutes | Completely cure time- 24 to 48 hrs | Save at degrees to 28 degrees of preservation
- Package Includes: 1-Pc Original ZHANLIDA 50-ml T7000 Black Adhesive Glue
- Imported lead-free materials, perfect formula, high quality.
- Make of the newest rosin and other imported high-quality materials.
- Embellish tin fast, low smoke, less residue and surface with low insulation resistance.
- Great soldering work tool for smart phone, PCB, BGA, electronic parts repairing.
- Transparent residue, no washing needed.
- Mild pH, no corrosiveness to IC or PCB.
- Melting point is slightly higher than soldering tin
- Can make the resistance in the welding process auxiliary accurate return, professional solution QFN / BGA hollow bubble, dense foot IC residue and so on.
- In the welding, can make the parent metal surface oxide reduction, effectively eliminate the oxide film
138℃ low temperature tin paste
Low temperature lead-free solder paste customized for high-end machine motherboard repair
Lead-free environmental protection
High purityDelicate stickiness
138℃ low melting point
The temperature is accurate, the tin is lit, and the circuit board components are effectively protected
1. Imported rosin from Japan, environmentally , lead-free and halogen-free, with high safety.
2. Strong activity, good viscosity, good fluidity and easier tinning.
3. Milky white paste, no residue, fast tinning.
4. High insulation resistance, suitable for mobile phone motherboards, cpu repair, etc.
CE – ROHS – FCC – ISO 9001-2008
RL-058 3 in 1 chip welding special set
. A set to solve the problem of chip soldering
.tube type BGA solder paste,Contains imported flux for better soldering effect