RELIFE RL-039 BGA-IC GLUE REMOVE LIQUID

450.00

BGA-IC Adhesive Remove Liquid, High-effect
For the mobile phone BGA/IC Resin sealant
Softened and removed, Scientific formula
Does not hurt the Motherboard or Component
RL-039 can quickly soften Resin

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Description

BGA-IC Adhesive Remove Liquid, High-effect
For the mobile phone BGA/IC Resin sealant
Softened and removed, Scientific formula
Does not hurt the Motherboard or Component
RL-039 can quickly soften Resin

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Shipping & Handling-
If Your placing a Order Your order will be in Process Immediately & on Same Day You will get

Tracking order on your whats-app or on your Email at Evening 7.00 pm to 9.00 pm

Delivery Time
In City & Town Area it will Take approx 5 to 6 days, Village or Rural Area it will take approx 7 to 8 days

Note – If you want enquirer about Delivery you can Whats App Us On This Number – 9967040744

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