Weight | 50 g |
---|---|
Brand | Relife |
RELIFE CP-002 Multi Purpose Glue 50ml Black Gel
₹99.00 ₹150.00
Price Summary
- ₹150.00
- ₹99.00
- 34%
- ₹99.00
- Overall you save ₹51.00 (34%) on this product
Be the first to review “RELIFE CP-002 Multi Purpose Glue 50ml Black Gel” Cancel reply
Related Products
FLUX PASTE BABA FP207
- Smooth Welding Surface
- No Deterioration No Dry
- No Poison No Corrosion
- Joint High Intensity Neutral PH7=0.3
- Good Immersion
- Good Insulation
SUNSHINE G-20 Multipurpose Glue Transparent
Widely used,suitable for electronic products/mobile phones/crystal jewelry/leather/clocks, etc.
Needle mouth design, save environmental protection, no waste, no clogging
High-strength adhesion,brushing effect is good
RELIFE RL-404 SOLDER PPD PASTE 138°C
138℃ low temperature tin paste
Low temperature lead-free solder paste customized for high-end machine motherboard repair
Lead-free environmental protection
High purityDelicate stickiness
138℃ low melting point
The temperature is accurate, the tin is lit, and the circuit board components are effectively protected
MECHANIC UV50 Soldering Paste
- Great soldering work tool for smart phone, PCB, BGA, electronic parts repairing.
- Transparent residue, no washing needed.
- Mild pH, no corrosiveness to IC or PCB.
- Melting point is slightly higher than soldering tin
MECHANIC FLUX PASTE Uv223
- 100% new brand and high quality.
- Good immersion and high intensity joint.
- Easy to peel off with hands or tweezers, leave no residue.
- Won’t oxidating gold, copper, phosphorus, bronze, oxidation.
- High soaking ,high strength joints.
- No-toxic, no-corrosive, strong ability of insulation.
- Good insulation and smooth welding surface.
- No deterioration no dry.
- No poison no orrosion, no damage to parts.
Mechanic White F913 Flux Paste
- Can make the resistance in the welding process auxiliary accurate return, professional solution QFN / BGA hollow bubble, dense foot IC residue and so on.
- In the welding, can make the parent metal surface oxide reduction, effectively eliminate the oxide film
RELIFE RL-039 BGA-IC GLUE REMOVE LIQUID
BGA-IC Adhesive Remove Liquid, High-effect
For the mobile phone BGA/IC Resin sealant
Softened and removed, Scientific formula
Does not hurt the Motherboard or Component
RL-039 can quickly soften Resin
T7000 Black Glue
- Special Glue For Laptop / Mobile Phone LCD, Touch, Folder Changing, Bezels, Gorilla Glass Lens
- T7000 GLUE Appearance – BLACK semi floating body | solid content – 30% – 35% | After curing hardness – 65- 80A | Surface drying time – 3 minutes | Completely cure time- 24 to 48 hrs | Save at degrees to 28 degrees of preservation
- Package Includes: 1-Pc Original ZHANLIDA 50-ml T7000 Black Adhesive Glue
SUNSHINE FLUX PASTE RMA-229-TPF (UV)
- Imported lead-free materials, perfect formula, high quality.
- Make of the newest rosin and other imported high-quality materials.
- Embellish tin fast, low smoke, less residue and surface with low insulation resistance.
Max Gold Soldering De-Soldering Paste
This paste is generally preferred by Industry people.
High quality soldering paste flux used for all kind of quality soldering and de-soldering applications
ROSIN SOLDERING FLUX PASTE
- BIT CLEANER
- A good quality product
- Easy to use
- Easy to carry
- 100% Tested
- 10gm
Recently Viewed
Soldering Iron V501 (Koocu)
High Insulation Soldering Iron V501
RELIFE Active Solder Wire RL-440
RELIFE RL-440 Active Medium Temperature Solder Wire
Rosin welding line SN20/PN80 Weight: 20Gr, Size: 0,6mm
1: Full name net weight, no false.
2: Including soldering rosin for better soldering effect
3: Medium temperature melting point
Widely used for maintenance work such as mobile phone repair.
Xiaomi King Tool 10 Credits Pack
Xiaomi King Tool by Credits for existing user
Processing time : 1-10 Miniutes
Xiaomi Mi Precision Screwdriver Kit
- Screwdriver set with 24 bits in one box having hard material and Hardlooking Matt finish, Which prevents it from any damage and scratches.
- Imported product with high quality material composition and aesthetic design.
EFT Pro Dongle 2 Year Activation
- The root method is new and exclusive and never happened before
- The root is official and doesn’t need anything like flashing custom recoveries or ZIP files
- The root is clean and works in the device without touching partitions like: data, system, cache…
- The root rebuilds itself during each boot and also after the factory reset
- The root doesn’t cause any problems with Wi-Fi, booting, fingerprint, Knox….
Digital Microscope 4.3 Inch Hd 3.6Mp 1-600X Magnifier
Pixel: HD 3.6MP
2. Display: 4.3 inches HD LCD display
3. Magnification: 1-600X continuous magnification system
4. Object distance: 15mm infinity(depend on the different distance)
5. Built-in lithium battery, available for working more than 6 hours continuously
6. Power DC interface
7. Memory card’s socket(Micro SD)
8. Brightness adjust button
9. REST button, restore the system(if the machine can not work, please press the button with sharp objects to restart it)
10. Fast loading 4 holes’s bayonet, push the bracket’s 4 claws into the bayonet, hearing “Ka” once, it says the assemble is finished
11. High brightness 8 LEDs, available for up to 100 thousand hours
Mechanic BGA IC Adhesive Removing Liquid (Mechanic QC-20)
- 20ml BGA IC glue epoxy remover.
- Can help you soften & remove resinating/sealing glue of chip BGA IC of mobile phones easily.
- Can quickly soften and loosen solidified resin adhesive such as epoxy, phenolics, acrylate, polyurethane, organosilicon, etc.
- It won’t do harm to your circuit board and components.
- Environment friendly and safe. Doesn’t contain any Benzene Coderivative substances with cause leukemia.
There are no reviews yet.