Glue / flux paste & Solder Mask

Glue / flux paste & Solder Mask

(Showing 37 – 48 products of 60 products)

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Mechanic XG-50 50gm SMD Solder Paste

Highlights:

This is solder paste for soldering small SMD components in reflow oven or with hot air soldering station. comes in a small container for prototyping or repairing job. This pack is right amount of solder paste for most of the hobby projects. This paste is replacement of solder wire used in Through hole soldering, some times solder flux is referred as solder paste. This solder paste comes in a special container, when it is sealed, it can survive for 6 months. If you open the container and want to store rest of the paste for future use make sure it is tight and place it in a plastic zipper pouch and place it in the refrigerator.

RELIFE BGA FLUX PASTE RL-421-OR

Highlights:
  • Imported rosin ,no virtual welding, easy to tin.
  • The color is pure, no impurities.
  • Running tin is fast and has less smoke.
  • High insulation resistance, suitable for mobile phone PCB,CPU repair.

RELIFE MULTI-PURPOSE ADHESIVES GLUE CP-0001

Highlights:
  • CP-0001 series products are kind of special environmental protection adhesive glue suitable for bonding use in mobile phones, tablet PC, diamond jewellery, craft gifts and other industries.
  • The colloid is not easy to wire drawing, with unique packaging, and easy to use, which can greatly reduce unnecessary trouble and save more valuable time.

RELIFE RL-039 BGA-IC GLUE REMOVE LIQUID

Highlights:

BGA-IC Adhesive Remove Liquid, High-effect
For the mobile phone BGA/IC Resin sealant
Softened and removed, Scientific formula
Does not hurt the Motherboard or Component
RL-039 can quickly soften Resin

Relife Rl-058 3 In 1 Chip Welding Equipments Solder Set

Highlights:

RL-058 3 in 1 chip welding special set
. A set to solve the problem of chip soldering
.tube type BGA solder paste,Contains imported flux for better soldering effect

RELIFE RL-223-OR Solder Paste 100g

Highlights:
  • Designed for soldering and reballing BGA, PGA and SMD components on phone mainboards.
  • Lead free and no residue.
  • Features high viscosity and high activity.
  • Provides quick and high-quality tinning with a minimum amount of smoke.
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