Note – This Motherboard Is Scrap Motherboard Not a Working Board Please Order Only for IC & Components Use
Samsung A12 4g Scrap Motherboard
₹199.00 ₹300.00
Price Summary
- ₹300.00
- ₹199.00
- 34%
- ₹199.00
- Overall you save ₹101.00 (34%) on this product
Be the first to review “Samsung A12 4g Scrap Motherboard” Cancel reply
Related Products
Redmi Note 9 Pro Scrap Motherboard
Note – This Motherboard Is Scrap Motherboard Not a Working Board Please Order Only for IC & Components Use
Samsung A70 Scrap Motherboard
Note – This Motherboard Is Scrap Motherboard Not a Working Board Please Order Only for IC & Components Use
Redmi Note 11 Pro 5g Scrap Motherboard
Note – This Motherboard Is Scrap Motherboard Not a Working Board Please Order Only for IC & Components Use
Realme Not 10 5g Scrap Motherboard
Note – This Motherboard Is Scrap Motherboard Not a Working Board Please Order Only for IC & Components Use
Oppo Reno 8 4g Scrap Motherboard
Note – This Motherboard Is Scrap Motherboard Not a Working Board Please Order Only for IC & Components Use
Mi 9 Power Scrap Motherboard
Note – This Motherboard Is Scrap Motherboard Not a Working Board Please Order Only for IC & Components Use
Samsung A13 5g Scrap Motherboard
Note – This Motherboard Is Scrap Motherboard Not a Working Board Please Order Only for IC & Components Use
Recently Viewed
T7000 Black Glue
- Special Glue For Laptop / Mobile Phone LCD, Touch, Folder Changing, Bezels, Gorilla Glass Lens
- T7000 GLUE Appearance – BLACK semi floating body | solid content – 30% – 35% | After curing hardness – 65- 80A | Surface drying time – 3 minutes | Completely cure time- 24 to 48 hrs | Save at degrees to 28 degrees of preservation
- Package Includes: 1-Pc Original ZHANLIDA 50-ml T7000 Black Adhesive Glue
RELIFE RL-068 Mini Regulation Polish Pen
Martview RB-01 Reballing Stencil Full Set
- Support for EMMC EMCP UFS BGA153 BGA162 BGA169 BGA186 BGA221 BGA254
- Stencil net thickness: 0.15mm
- Holder size: 80*80*15mm
- Packing size: 89*89*32mm
RELIFE RL-039 BGA-IC GLUE REMOVE LIQUID
BGA-IC Adhesive Remove Liquid, High-effect
For the mobile phone BGA/IC Resin sealant
Softened and removed, Scientific formula
Does not hurt the Motherboard or Component
RL-039 can quickly soften Resin
UMT Pro Dongle V2 + Martview All Boot Cable (Combo Offer)
UMT Pro Dongle V2 + Martview All Boot Cable (Combo Offer)
Special Combo offer
Package includes:
1 x UMT Pro Dongle V2 + 1 x Martview All Boot Cable
B7000 Glue For Mobile Phone 50ML
- This Transparent glue can be use with Mobile repairing , Jewelry , craft , cloths and other household goods.
- B7000 Glue is ideal for portable electronic goods.
- This glue is transparent in color. 50ml in quantity.
- It is a very strong and effective glue.
There are no reviews yet.