Model : Supported Ic’s
MSM8953 BOI-MSM8937-MSM8998 B- MSM8953 1AB-MSM8916-MSM8998 A
₹270.00 ₹300.00
Model : Supported Ic’s
MSM8953 BOI-MSM8937-MSM8998 B- MSM8953 1AB-MSM8916-MSM8998 A
TFM Tool Pro Activation (2 YEAR)
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BGA-IC Adhesive Remove Liquid, High-effect
For the mobile phone BGA/IC Resin sealant
Softened and removed, Scientific formula
Does not hurt the Motherboard or Component
RL-039Â can quickly soften Resin
UFI-Lite USB3.0 SuperSpeed uSD/eMMC Reader for UFI Box . UFI Box is a powerful EMMC Service Tool that can Read EMMC user data, as well as repair, resize, format, erase, read write and update the firmware on EMMC in Samsung, China phone SK Hynix, Toshiba, Kingston, micron, and other brands.
10-20 Mins DELIVERY TIME
DFT PRO Tool 1 Year – RENEWAL
1-5 HOURS DELIVERY TIME
EFT Pro Tool No need Dongle 1 Year Plan
Processing time : 1-5 Miniutes
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