Model : Supported Ic’s
77920’21-56020-7210M’11-PM1632-SDR660-PM670A-BGA254-PM670-PM 7150-
₹270.00 ₹300.00
Model : Supported Ic’s
77920’21-56020-7210M’11-PM1632-SDR660-PM670A-BGA254-PM670-PM 7150-
BGA-IC Adhesive Remove Liquid, High-effect
For the mobile phone BGA/IC Resin sealant
Softened and removed, Scientific formula
Does not hurt the Motherboard or Component
RL-039Â can quickly soften Resin
SUNSHINE SS-928D PORTABLE THERMOSTAT SOLDERING IRON
1. Using latest advanced temperature control circuit, precise temperature adjustment.
2. Equipped with imported ceramic heating core with fast heating, high thermal efficiency, warm-back speed and long service life.
3. One button to lock working temperature, make repairing work
Miracle FRP Tool Dongle + Mobile Software Course Vol- 1
Special Combo offerÂ
Package includes:
1 x Miracle FRP Tool Dongle + 1 x Mobile Software Course Vol- 1
UFI Box Replacement Sim
THIS IS INTERNATIONAL VERSION SIM USE FOR ANY VERSION BOX LIKE WORLDWIDE,INDIAN,INDONASIAN,PAKISTAN
NOTE:-Â Â THIS IS ONLY FOR SIM SWAP & IF ANY CASE BLOCK YOUR BOX OLD SIM BETWEEN UDTATE- THIS SIM FOR
REPLACEMENT
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