Note – This Motherboard Is Scrap Motherboard Not a Working Board Please Order Only for IC & Components Use
Oppo A74 Scrap Motherboard
₹199.00 ₹300.00
Price Summary
- ₹300.00
- ₹199.00
- 34%
- ₹199.00
- Overall you save ₹101.00 (34%) on this product
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RELIFE RL-039 BGA-IC GLUE REMOVE LIQUID
BGA-IC Adhesive Remove Liquid, High-effect
For the mobile phone BGA/IC Resin sealant
Softened and removed, Scientific formula
Does not hurt the Motherboard or Component
RL-039 can quickly soften Resin
RELIFE RL-402 183℃ PPD PASTE
1.RELIFE ,real quality ,born for mobile repair.
2.RELIFE 183℃ solder paste ,unique manufacturing of solder paste technology, giving a new definition of tin-based technology.
3.Special choose No. 4 solder material, Sn63/Pb3 ,exquisite,less residual,Special for mobile repair.
4.Packaging materials use first-grade raw materials, environmentally friendly and non-toxic.
5.Backed by tinning technology.not only need skilled craftsmanship, but also need RELIFE solder paste.
RELIFE RL-223-OR Solder Paste 100g
- Designed for soldering and reballing BGA, PGA and SMD components on phone mainboards.
- Lead free and no residue.
- Features high viscosity and high activity.
- Provides quick and high-quality tinning with a minimum amount of smoke.
RELIFE BGA FLUX PASTE RL-421-OR
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Imported rosin ,no virtual welding, easy to tin.
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The color is pure, no impurities.
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Running tin is fast and has less smoke.
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High insulation resistance, suitable for mobile phone PCB,CPU repair.
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