Type: Solder Flux
Size: About 150*21mm
Semi-solid: Not Easy to Dump
Particle Size: 1-10μm
No-clean: Low Solids Content
Net Weight: About 15.0g / pcs
Model Number: SD360 & SD360 Max
Environmental: Lead-free
₹350.00 ₹450.00
Type: Solder Flux
Size: About 150*21mm
Semi-solid: Not Easy to Dump
Particle Size: 1-10μm
No-clean: Low Solids Content
Net Weight: About 15.0g / pcs
Model Number: SD360 & SD360 Max
Environmental: Lead-free
1. Imported rosin from Japan, environmentally , lead-free and halogen-free, with high safety.
2. Strong activity, good viscosity, good fluidity and easier tinning.
3. Milky white paste, no residue, fast tinning.
4. High insulation resistance, suitable for mobile phone motherboards, cpu repair, etc.
CE – ROHS – FCC – ISO 9001-2008
High Insulation Soldering Iron V501
UFI-Lite USB3.0 SuperSpeed uSD/eMMC Reader for UFI Box . UFI Box is a powerful EMMC Service Tool that can Read EMMC user data, as well as repair, resize, format, erase, read write and update the firmware on EMMC in Samsung, China phone SK Hynix, Toshiba, Kingston, micron, and other brands.
Miracle Huawei Tool Thunder Edition
[+] For use Miracle Huawei Tool Must Buy Miracle Huawei Pack 4 in 1
# Miracle Moto Tool Free with Huawei Tool
# Miracle eMMC Tool Free with Huawei Tool
# Miracle Vivo Tool Free with Huawei Tool
# Once Order Placed Can’t Cancel.
# You Need to Write Miracle Key or Miracle Thunder Serial Number.
# Wrong Serial Number Credits No Refund.
RELIFE RL-440 Active Medium Temperature Solder Wire
Rosin welding line SN20/PN80 Weight: 20Gr, Size: 0,6mm
1: Full name net weight, no false.
2: Including soldering rosin for better soldering effect
3: Medium temperature melting point
Widely used for maintenance work such as mobile phone repair.
Universal Mobile Phone Repair Tools Tablet Opening Tools Suction Cup Removing Disassemble LCD Screen Glass Replacement Opener
Special Combo offer
Package includes:
1 x UMT Dongle + 1 x Mobile Software Course Vol- 1
1.RELIFE ,real quality ,born for mobile repair.
2.RELIFE 183℃ solder paste ,unique manufacturing of solder paste technology, giving a new definition of tin-based technology.
3.Special choose No. 4 solder material, Sn63/Pb3 ,exquisite,less residual,Special for mobile repair.
4.Packaging materials use first-grade raw materials, environmentally friendly and non-toxic.
5.Backed by tinning technology.not only need skilled craftsmanship, but also need RELIFE solder paste.
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