Estech Schematics Activation Code (6 Month) – Intant
Processing time : 10 – Miniutes
₹1,102.00 ₹2,000.00
Estech Schematics Activation Code (6 Month) – Intant
Processing time : 10 – Miniutes
138℃ low temperature tin paste
Low temperature lead-free solder paste customized for high-end machine motherboard repair
Lead-free environmental protection
High purityDelicate stickiness
138℃ low melting point
The temperature is accurate, the tin is lit, and the circuit board components are effectively protected
This is Normal 1 year activation to use all modules but not related to HUAWEI Module.
For Huawei module you must purchase it on its own and it is unlimited = no yearly activation needed
SUNSHINE SS-928D PORTABLE THERMOSTAT SOLDERING IRON
1. Using latest advanced temperature control circuit, precise temperature adjustment.
2. Equipped with imported ceramic heating core with fast heating, high thermal efficiency, warm-back speed and long service life.
3. One button to lock working temperature, make repairing work
Please Register First and then Enter User Name for Activation
Please Register Here – https://unlocktool.net/register/
Guide Videos Link – https://unlocktool.net/blog/
Download Link – https://unlocktool.net/download/
Use this tool to repair BGA chip, for example, baseband,CPU, etc. can play a multimeter effect. Besides, it is easy to oeprate, never drop point, not peeling cooper, easy to clean, etc. Safe and risk-free, air-gun temperature should be at 340 betwenn 360 and wind speed 28-30.
BGA-IC Adhesive Remove Liquid, High-effect
For the mobile phone BGA/IC Resin sealant
Softened and removed, Scientific formula
Does not hurt the Motherboard or Component
RL-039 can quickly soften Resin
Ultimate Multi Tool Box Features:
Get access to your Orders, Wishlist and Recommendations.
Your personal data will be used to support your experience throughout this website, to manage access to your account, and for other purposes described in our privacy policy.
WhatsApp us
There are no reviews yet.