Model : Supported Ic’s
BGA162-BGA153-BGA169-BGA221-BGA186-BGA297-BGA254-BGD178-BGS2000
BGA110-BGA60-BGA70
₹270.00 ₹300.00
Model : Supported Ic’s
BGA162-BGA153-BGA169-BGA221-BGA186-BGA297-BGA254-BGD178-BGS2000
BGA110-BGA60-BGA70
BGA-IC Adhesive Remove Liquid, High-effect
For the mobile phone BGA/IC Resin sealant
Softened and removed, Scientific formula
Does not hurt the Motherboard or Component
RL-039Â can quickly soften Resin
Widely used,suitable for electronic products/mobile phones/crystal jewelry/leather/clocks, etc.
Needle mouth design, save environmental protection, no waste, no clogging
High-strength adhesion,brushing effect is good
High efficiency and save the electric repairing time. Avoid the high temperature destruction of electric pad. Design in precision,guarantee the max surface tension and the ability of absorbing tin. Speed up the speed of absorbing tin and low residue of flux. Increase the speed of cleaning the PCB pad. Oxidation resistivity and anti-corrosion protection,good thermal conductivity.
EFT Pro Tool No need Dongle 1 Year Plan
Processing time : 1-5 Miniutes
TFM Tool Pro Activation (1 YEAR)
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138℃ low temperature tin paste
Low temperature lead-free solder paste customized for high-end machine motherboard repair
Lead-free environmental protection
High purityDelicate stickiness
138℃ low melting point
The temperature is accurate, the tin is lit, and the circuit board components are effectively protected
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