RELIFE RL-223-OR Solder Paste 100g

RELIFE RL-223-OR Solder Paste 100g

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RELIFE RL-223-OR Solder Paste 100g

Highlights:
  • Designed for soldering and reballing BGA, PGA and SMD components on phone mainboards.
  • Lead free and no residue.
  • Features high viscosity and high activity.
  • Provides quick and high-quality tinning with a minimum amount of smoke.
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