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RELIFE RL-039 BGA-IC GLUE REMOVE LIQUID

Highlights:

BGA-IC Adhesive Remove Liquid, High-effect
For the mobile phone BGA/IC Resin sealant
Softened and removed, Scientific formula
Does not hurt the Motherboard or Component
RL-039 can quickly soften Resin

Relife Rl-058 3 In 1 Chip Welding Equipments Solder Set

Highlights:

RL-058 3 in 1 chip welding special set
. A set to solve the problem of chip soldering
.tube type BGA solder paste,Contains imported flux for better soldering effect

RELIFE RL-068 Mini Regulation Polish Pen

Highlights:
RELIFE RL-068 Mini polishing Pen
1 . Solve the problem of traditional grinding pen  shake , no  shake rotation at high speed, and safer grinding chip  .
2.Long gourd appearance design is more comfortable to hold
3. Configure  8 different specifications, suitable for repair chip IC grinding, cutting
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