Unlock Credits Pricing & Unlock Credits:
Promo period:
– From 1.07.2017 till 31.07.2017 – 1 success code reading will take 5 credits.
– From 31.07.2017 – 1 success code reading will take 10 credits.
Price for 50 credits = 70 usd.
₹2,899.00 ₹3,100.00
Unlock Credits Pricing & Unlock Credits:
Promo period:
– From 1.07.2017 till 31.07.2017 – 1 success code reading will take 5 credits.
– From 31.07.2017 – 1 success code reading will take 10 credits.
Price for 50 credits = 70usd.
Unlock Credits Pricing & Unlock Credits:
Promo period:
– From 1.07.2017 till 31.07.2017 – 1 success code reading will take 5 credits.
– From 31.07.2017 – 1 success code reading will take 10 credits.
Price for 50 credits = 70 usd.
XinZhiZao 3 account/3Year
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XinZhiZao 1 account/1Year – Redeem Code
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Renewal for Miracle Box extends your access to all the latest updates and support for one more year.
EME Mobile Tools Download Link –
http://www.emegsm.com/en/software.asp
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EME Mobile Tools Supported Modal –
https://www.martview-forum.com/thread…
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10-20 Mins DELIVERY TIME
Card active!. 1 Year activation active Use NCK Dongle v15.6 or above version When Activation msg display, UPDATE Card/Dongle Restart Software Now you can use all new modules.
Note: Please update card first using NCK Dongle Main Module v18.8 if card is updated security OK then submit NCK activation, If Card not update security then DO NOT SUBMIT
This is Normal 1 year activation to use all modules but not related to HUAWEI Module.
For Huawei module you must purchase it on its own and it is unlimited = no yearly activation needed
1 Pack = 10 Credits
– Now 1 Auth needs 10 Credits
– There will be NO refund in any case so make sure you really need to use it.
– Old QcFire 4.x can not connect to new server anymore
– Check forum for reports on your model before doing anything with credits
– Mi Account relock CAN NOT be fixed with Mi Auth Credits.
BGA-IC Adhesive Remove Liquid, High-effect
For the mobile phone BGA/IC Resin sealant
Softened and removed, Scientific formula
Does not hurt the Motherboard or Component
RL-039 can quickly soften Resin
Suitable for mobile phone repair IC pad cleaning / motherboard removal
Remove glue from mobile phone motherboard
Electronic components cleaning
Computer motherboard glue removal
Clean up the dust
Excellent cleaning effect, no deformation, no hair loss, durable
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