SUNSHINE SS-046 3 in 1 Brush
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SUNSHINE SS-022B Anti-Static Motherboard PCB Cleaning Brush
Suitable for mobile phone repair IC pad cleaning / motherboard removal
Remove glue from mobile phone motherboard
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Clean up the dust
Excellent cleaning effect, no deformation, no hair loss, durable
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UMT 1 Year Activation
Ultimate Multi Tool 1 Year Activation
This is Normal 1 year activation to use all modules but not related to HUAWEI Module.
For Huawei module you must purchase it on its own and it is unlimited = no yearly activation needed
LED Magnifying Desktop Lamp
- Color: Black. Housing made by plastic to make it shock proof.
- 5X magnifying tabletop lamp offers the user a flexible adjustable height for more convenient work. 10W Cool-white Light for reducing user’s eye fatigue.
- Protection Cover for keep the magnifying Lamp free from dust. Solid plastic construction.
UMT+Nck Pro Dongle + Mobile Software Course Vol-1
Special Combo offerÂ
Package includes:
1 x UMT+Nck Pro Dongle + 1 x Mobile Software Course Vol- 1
IBoot Power Supply Box Test Tools
FeatureÂ
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Applicable to Android phones , Support Huawei , Samsung , Xiaomi , Glory , OPPO, VIVO , Meizu Red Rice , ZTE , LG, Mito, LeTv, Lenovo , Hisense< ACRE Nubia , Nokia , one Plus, Jinli, Cool, Sony , HTC , Blackberry and Meny Mor
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Boot Port adopts 16 PCS Cable Buckle Designs, Supply for Widely Cell Phone
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The Battery Base Match the Cable buckles Corresponding, it can be use
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Overcurrent Protection, When the Current Over 3A , the pratection function automatically
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The inputVoltage Over 4.8v, it will be automatically disconnect to prevent the phone from burning out
GSM Shield Dongle
GSM Shield Dongle allows you to perform Flash, Unlock, Reset FRP and many other operations on Qualcomm, Mediatek, and Spreadtrum-based phones.
EME Mobile Tools (EMT)
EME Mobile Tools Download Link –
http://www.emegsm.com/en/software.asp
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EME Mobile Tools Supported Modal –
https://www.martview-forum.com/thread…
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RELIFE RL-039 BGA-IC GLUE REMOVE LIQUID
BGA-IC Adhesive Remove Liquid, High-effect
For the mobile phone BGA/IC Resin sealant
Softened and removed, Scientific formula
Does not hurt the Motherboard or Component
RL-039Â can quickly soften Resin
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