RELIFE RL-101H Main Board Middle Layer Layered Special Blade For Mobile Phone Motherboard Chip Repair Bevel Layered Blade


RELIFE RL-101H MIDDLE LAYERED SPECIAL BLADE SET
₹199.00 ₹300.00
Price Summary
- ₹300.00
- ₹199.00
- 34%
- ₹199.00
- Overall you save ₹101.00 (34%) on this product
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Mechanic BGA IC Adhesive Removing Liquid (Mechanic QC-20)
- 20ml BGA IC glue epoxy remover.
- Can help you soften & remove resinating/sealing glue of chip BGA IC of mobile phones easily.
- Can quickly soften and loosen solidified resin adhesive such as epoxy, phenolics, acrylate, polyurethane, organosilicon, etc.
- It won’t do harm to your circuit board and components.
- Environment friendly and safe. Doesn’t contain any Benzene Coderivative substances with cause leukemia.
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