RELIFE RL-101H Main Board Middle Layer Layered Special Blade For Mobile Phone Motherboard Chip Repair Bevel Layered Blade


RELIFE RL-101H MIDDLE LAYERED SPECIAL BLADE SET
₹199.00 ₹300.00
Price Summary
- ₹300.00
- ₹199.00
- 34%
- ₹199.00
- Overall you save ₹101.00 (34%) on this product
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FTP Activation For EFT Pro Dongle
Downloading daily 30 files – Upto 10800 files for year .
Download All Firmware Unlimited ñ Software Features:
– One-Click login to support area from the FTP File Dongle main software.
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RELIFE RL-039 BGA-IC GLUE REMOVE LIQUID
BGA-IC Adhesive Remove Liquid, High-effect
For the mobile phone BGA/IC Resin sealant
Softened and removed, Scientific formula
Does not hurt the Motherboard or Component
RL-039 can quickly soften Resin
TFM Tool Pro Activation (2 YEAR)
TFM Tool Pro Activation (2 YEAR)
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Mechanic BGA IC Adhesive Removing Liquid (Mechanic QC-20)
- 20ml BGA IC glue epoxy remover.
- Can help you soften & remove resinating/sealing glue of chip BGA IC of mobile phones easily.
- Can quickly soften and loosen solidified resin adhesive such as epoxy, phenolics, acrylate, polyurethane, organosilicon, etc.
- It won’t do harm to your circuit board and components.
- Environment friendly and safe. Doesn’t contain any Benzene Coderivative substances with cause leukemia.
DZKJ PhoneRepair Tools 3 Year 3 User
DZKJ PhoneRepair Tools 3 Year 3 User
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10-20 Mins DELIVERY TIME
Z3X Unlock (30 Credits Pack)
Unlock Credits Pricing & Unlock Credits:
Promo period:
– From 1.07.2017 till 31.07.2017 – 1 success code reading will take 5 credits.
– From 31.07.2017 – 1 success code reading will take 10 credits.
Price for 50 credits = 70usd.
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