Weight | 50 g |
---|---|
Brand | Relife |
RELIFE CP-002 Multi Purpose Glue 50ml Black Gel
₹99.00 ₹150.00
Price Summary
- ₹150.00
- ₹99.00
- 34%
- ₹99.00
- Overall you save ₹51.00 (34%) on this product
Be the first to review “RELIFE CP-002 Multi Purpose Glue 50ml Black Gel” Cancel reply
Related Products
Max -Soldering Paste ZJ-18
- The Solder Paste is a high viscosity no-clean flux , it can be used for PCB , SMD, reworking, it can be used for soldering and reballing of computer and phone chips .
- It is the mixture of high-quality alloyed powder and resinic pasty flux , it can avoid the pale yellow residue, so you are easy to clean the board.
B7000 Glue For Mobile Phone 50ML
- This Transparent glue can be use with Mobile repairing , Jewelry , craft , cloths and other household goods.
- B7000 Glue is ideal for portable electronic goods.
- This glue is transparent in color. 50ml in quantity.
- It is a very strong and effective glue.
RELIFE RL-223-OR Solder Paste 100g
- Designed for soldering and reballing BGA, PGA and SMD components on phone mainboards.
- Lead free and no residue.
- Features high viscosity and high activity.
- Provides quick and high-quality tinning with a minimum amount of smoke.
MECHANIC FLUX PASTE Uv223
- 100% new brand and high quality.
- Good immersion and high intensity joint.
- Easy to peel off with hands or tweezers, leave no residue.
- Won’t oxidating gold, copper, phosphorus, bronze, oxidation.
- High soaking ,high strength joints.
- No-toxic, no-corrosive, strong ability of insulation.
- Good insulation and smooth welding surface.
- No deterioration no dry.
- No poison no orrosion, no damage to parts.
Max Gold Soldering De-Soldering Paste
This paste is generally preferred by Industry people.
High quality soldering paste flux used for all kind of quality soldering and de-soldering applications
RELIFE RL-404 SOLDER PPD PASTE 138°C
138℃ low temperature tin paste
Low temperature lead-free solder paste customized for high-end machine motherboard repair
Lead-free environmental protection
High purityDelicate stickiness
138℃ low melting point
The temperature is accurate, the tin is lit, and the circuit board components are effectively protected
Relife Rl-058 3 In 1 Chip Welding Equipments Solder Set
RL-058 3 in 1 chip welding special set
. A set to solve the problem of chip soldering
.tube type BGA solder paste,Contains imported flux for better soldering effect
RELIFE RL-039 BGA-IC GLUE REMOVE LIQUID
BGA-IC Adhesive Remove Liquid, High-effect
For the mobile phone BGA/IC Resin sealant
Softened and removed, Scientific formula
Does not hurt the Motherboard or Component
RL-039 can quickly soften Resin
ROSIN SOLDERING FLUX PASTE
- BIT CLEANER
- A good quality product
- Easy to use
- Easy to carry
- 100% Tested
- 10gm
MECHANIC UV50 Soldering Paste
- Great soldering work tool for smart phone, PCB, BGA, electronic parts repairing.
- Transparent residue, no washing needed.
- Mild pH, no corrosiveness to IC or PCB.
- Melting point is slightly higher than soldering tin
RELIFE BGA FLUX PASTE RL-421-OR
-
Imported rosin ,no virtual welding, easy to tin.
-
The color is pure, no impurities.
-
Running tin is fast and has less smoke.
-
High insulation resistance, suitable for mobile phone PCB,CPU repair.
T7000 Black Glue
- Special Glue For Laptop / Mobile Phone LCD, Touch, Folder Changing, Bezels, Gorilla Glass Lens
- T7000 GLUE Appearance – BLACK semi floating body | solid content – 30% – 35% | After curing hardness – 65- 80A | Surface drying time – 3 minutes | Completely cure time- 24 to 48 hrs | Save at degrees to 28 degrees of preservation
- Package Includes: 1-Pc Original ZHANLIDA 50-ml T7000 Black Adhesive Glue
Recently Viewed
Mechanic BGA IC Adhesive Removing Liquid (Mechanic QC-20)
- 20ml BGA IC glue epoxy remover.
- Can help you soften & remove resinating/sealing glue of chip BGA IC of mobile phones easily.
- Can quickly soften and loosen solidified resin adhesive such as epoxy, phenolics, acrylate, polyurethane, organosilicon, etc.
- It won’t do harm to your circuit board and components.
- Environment friendly and safe. Doesn’t contain any Benzene Coderivative substances with cause leukemia.
IBoot Power Supply Box Test Tools
Feature
-
Applicable to Android phones , Support Huawei , Samsung , Xiaomi , Glory , OPPO, VIVO , Meizu Red Rice , ZTE , LG, Mito, LeTv, Lenovo , Hisense< ACRE Nubia , Nokia , one Plus, Jinli, Cool, Sony , HTC , Blackberry and Meny Mor
-
Boot Port adopts 16 PCS Cable Buckle Designs, Supply for Widely Cell Phone
-
The Battery Base Match the Cable buckles Corresponding, it can be use
-
Overcurrent Protection, When the Current Over 3A , the pratection function automatically
-
The inputVoltage Over 4.8v, it will be automatically disconnect to prevent the phone from burning out
MRT Dongle + Mobile Software Course Vol- 1
Special Combo offer
Package includes:
1 x MRT Dongle + 1 x Mobile Software Course Vol- 1
There are no reviews yet.