Model : Supported Ic’s
QSC6270-MDM9600-MSM6260-MSM7227-QSC1105-MDM8215-MDM9215M-
MSM7521
₹270.00 ₹300.00
Model : Supported Ic’s
QSC6270-MDM9600-MSM6260-MSM7227-QSC1105-MDM8215-MDM9215M-
MSM7521
Miracle Boot Jig
Feature:
5 in 1 IC BGA Chip Repair Kit with Handle for iPhone Motherboard CPU Remover Glue Cleaning Mobile Phone Repair Tools
Size: 161mm
Proffesional repair tool set for iPhone CPU disassemble. For BGA repair,dismantling phone CPU chip and phone repair. It can be used to separate the welding spot.
Special Combo offer
Package includes:
1 x UMT Pro Dongle V2 + 1 x Mobile Software Course Vol- 1
EFT Pro Tool No need Dongle 1 Year Plan
Processing time : 1-5 Miniutes
BGA-IC Adhesive Remove Liquid, High-effect
For the mobile phone BGA/IC Resin sealant
Softened and removed, Scientific formula
Does not hurt the Motherboard or Component
RL-039 can quickly soften Resin
TFM Tool Pro Activation (2 YEAR)
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