Model : Supported Ic’s
0.40X16X16-0.35X12X12-PM6150-PM6150L-PM562-PM660A/L–
PM8150C-PM8150B-PM8150A-PM845-PM540-PMI632-PM640-
PM670A/L-PM660-PM670-PM8150-PM489-PM660D
₹270.00 ₹300.00
Model : Supported Ic’s
0.40X16X16-0.35X12X12-PM6150-PM6150L-PM562-PM660A/L–
PM8150C-PM8150B-PM8150A-PM845-PM540-PMI632-PM640-
PM670A/L-PM660-PM670-PM8150-PM489-PM660D
EFT Pro Tool No need Dongle 1 Year Plan
Processing time : 1-5 Miniutes
This is Normal 1 year activation to use all modules but not related to HUAWEI Module.
For Huawei module you must purchase it on its own and it is unlimited = no yearly activation needed
– Proffesional Repair Toolkit for Iphone CPU disassembly
– For BGA repair, dismantle phone CPU chip and repair phone
– One handle & 43 blades in different shapes
– Handle Material: Titanium Alloy
BGA-IC Adhesive Remove Liquid, High-effect
For the mobile phone BGA/IC Resin sealant
Softened and removed, Scientific formula
Does not hurt the Motherboard or Component
RL-039Â can quickly soften Resin
Use this tool to repair BGA chip, for example, baseband,CPU, etc. can play a multimeter effect. Besides, it is easy to oeprate, never drop point, not peeling cooper, easy to clean, etc. Safe and risk-free, air-gun temperature should be at 340 betwenn 360 and wind speed 28-30.
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