OSS T12-BLS Solder Iron Tip
₹300.00 ₹450.00
Price Summary
- ₹450.00
- ₹300.00
- 33%
- ₹300.00
- Overall you save ₹150.00 (33%) on this product
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- Good ability to control temperature,quick thermal conductivity,
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RELIFE RL-223-OR Solder Paste 100g
- Designed for soldering and reballing BGA, PGA and SMD components on phone mainboards.
- Lead free and no residue.
- Features high viscosity and high activity.
- Provides quick and high-quality tinning with a minimum amount of smoke.
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TFM Tool Pro Activation (1 YEAR)
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UnlockTool 3 Month Activation
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Mechanic BGA IC Adhesive Removing Liquid (Mechanic QC-20)
- 20ml BGA IC glue epoxy remover.
- Can help you soften & remove resinating/sealing glue of chip BGA IC of mobile phones easily.
- Can quickly soften and loosen solidified resin adhesive such as epoxy, phenolics, acrylate, polyurethane, organosilicon, etc.
- It won’t do harm to your circuit board and components.
- Environment friendly and safe. Doesn’t contain any Benzene Coderivative substances with cause leukemia.
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