MTK MT Power Black Stencil (MEGA-IDEA)
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MTK MT Power Black Stencil (MEGA-IDEA)
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- ₹400.00
- ₹350.00
- 13%
- ₹350.00
- Overall you save ₹50.00 (13%) on this product
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RELIFE BGA FLUX PASTE RL-421-OR
Highlights:
-
Imported rosin ,no virtual welding, easy to tin.
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The color is pure, no impurities.
-
Running tin is fast and has less smoke.
-
High insulation resistance, suitable for mobile phone PCB,CPU repair.
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UMT Pro Dongle V2 + Martview All Boot Cable (Combo Offer)
Highlights:
UMT Pro Dongle V2 + Martview All Boot Cable (Combo Offer)
Special Combo offerÂ
Package includes:
1 x UMT Pro Dongle V2 + 1 x Martview All Boot Cable
₹4,100.00 ₹4,700.00
RELIFE RL-039 BGA-IC GLUE REMOVE LIQUID
Highlights:
BGA-IC Adhesive Remove Liquid, High-effect
For the mobile phone BGA/IC Resin sealant
Softened and removed, Scientific formula
Does not hurt the Motherboard or Component
RL-039Â can quickly soften Resin
₹510.00 ₹600.00
Kapton Polyimide Heat Resistant/High Temperature Tape 30mm X 33 Mtrs
Highlights:
- For the protection of PCB golden finger contact during wave soldering / dip soldering process
- Dimensionally stable at high temperature
- Best quality for Wave soldering during circuit board assembly
₹250.00 ₹350.00
Mobile Software Course Dvd Vol-1 (N.S Education)
Highlights:
1) ALL MOBILES PHONE FLASHING (All Chipsets)
2) COMPLETE ORIGINAL FLASH FILE
3) COMPLETE GUIDE TO USING All ORIGINAL FLASHER ( Odin , SP Flash Too ,  spd upgrade tools)
4) ALL MOBILE DRIVERS INSTALLATION METHOD (QUALCOMM , MTK, IPHONE, SAMSUNG,NOKIA, SPD,     COOLSAND/RDA, MSTAR, ADB, FASTBOOT, EDL, ETC.)
5) FRP/GOOGLE ACCOUNT REMOVE OF ALL MOBILES
6) UNLOCKING OF ALL MOBILES
7) DEAD BOOT REPAIR
8) FREE TOOLS & CRACKS
9) LIFETIME BACKUP AND SUPPORT
10) ALL TYEP OF BOX & DONGLE COMPLETE METHOD (Z3X BOX , Z3X PROÂ Â Â Â BOX , ATF BOX , MIRACLE BOX, UMT DONGLE ETC,,,,
₹700.00 ₹1,500.00
UMT Pro Dongle V2 + EDL Cable (Combo Offer)
Highlights:
Special Combo offerÂ
Package includes:
1 x UMT Pro Dongle V2 + 1 x EDL Cable
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₹270.00 ₹300.00
Mechanic BGA IC Adhesive Removing Liquid (Mechanic QC-20)
Highlights:
- 20ml BGA IC glue epoxy remover.
- Can help you soften & remove resinating/sealing glue of chip BGA IC of mobile phones easily.
- Can quickly soften and loosen solidified resin adhesive such as epoxy, phenolics, acrylate, polyurethane, organosilicon, etc.
- It won’t do harm to your circuit board and components.
- Environment friendly and safe. Doesn’t contain any Benzene Coderivative substances with cause leukemia.
₹350.00 ₹450.00
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