MT6771V-SDM845B-SDM710-MT6739V-MT6757V-SDM845A-SDM660-MT6763V
MQ 1 Stencil
₹270.00 ₹300.00
Price Summary
- ₹300.00
- ₹270.00
- 10%
- ₹270.00
- Overall you save ₹30.00 (10%) on this product
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Martview RB-01 Reballing Stencil Full Set
- Support for EMMC EMCP UFS BGA153 BGA162 BGA169 BGA186 BGA221 BGA254
- Stencil net thickness: 0.15mm
- Holder size: 80*80*15mm
- Packing size: 89*89*32mm
RELIFE RL-039 BGA-IC GLUE REMOVE LIQUID
BGA-IC Adhesive Remove Liquid, High-effect
For the mobile phone BGA/IC Resin sealant
Softened and removed, Scientific formula
Does not hurt the Motherboard or Component
RL-039 can quickly soften Resin
ZXW Online Account Activation
Here is How to Use this code
UMT Pro Dongle V2 + Mobile Software Course Vol- 1
Special Combo offer
Package includes:
1 x UMT Pro Dongle V2 + 1 x Mobile Software Course Vol- 1
Z3X Unlock (30 Credits Pack)
Unlock Credits Pricing & Unlock Credits:
Promo period:
– From 1.07.2017 till 31.07.2017 – 1 success code reading will take 5 credits.
– From 31.07.2017 – 1 success code reading will take 10 credits.
Price for 50 credits = 70usd.
NCK Pro Dongle Activation
Card active!. 1 Year activation active Use NCK Dongle v15.6 or above version When Activation msg display, UPDATE Card/Dongle Restart Software Now you can use all new modules.
Note: Please update card first using NCK Dongle Main Module v18.8 if card is updated security OK then submit NCK activation, If Card not update security then DO NOT SUBMIT
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