MT6771V-SDM845B-SDM710-MT6739V-MT6757V-SDM845A-SDM660-MT6763V
MQ 1 Stencil
₹270.00 ₹300.00
Price Summary
- ₹300.00
- ₹270.00
- 10%
- ₹270.00
- Overall you save ₹30.00 (10%) on this product
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Mechanic BGA IC Adhesive Removing Liquid (Mechanic QC-20)
- 20ml BGA IC glue epoxy remover.
- Can help you soften & remove resinating/sealing glue of chip BGA IC of mobile phones easily.
- Can quickly soften and loosen solidified resin adhesive such as epoxy, phenolics, acrylate, polyurethane, organosilicon, etc.
- It won’t do harm to your circuit board and components.
- Environment friendly and safe. Doesn’t contain any Benzene Coderivative substances with cause leukemia.
Octoplus FRP Tool Dongle
Octoplus FRP Tool allows you to reset Google Factory Reset Protection (FRP) for Samsung, Huawei, LG, Alcatel, Motorola cell phones.
Samsung Reset FRP operations.
1. “Reset FRP UART (UFS chips)” operation. This operation will not reset/delete device user data.
2. “Reset FRP ADB (Combination)” operation. This operation will not reset/delete device user data.
3. “Reset FRP (Download Mode)” operation. Be careful, performing this operation will delete all user data (contacts, pictures and other) from the device!
4. Reset FRP UART (eMMC chips) operation. This operation will not reset/delete user data on the device.
More Info Please Check Description
RELIFE RL-402 183℃ PPD PASTE
1.RELIFE ,real quality ,born for mobile repair.
2.RELIFE 183℃ solder paste ,unique manufacturing of solder paste technology, giving a new definition of tin-based technology.
3.Special choose No. 4 solder material, Sn63/Pb3 ,exquisite,less residual,Special for mobile repair.
4.Packaging materials use first-grade raw materials, environmentally friendly and non-toxic.
5.Backed by tinning technology.not only need skilled craftsmanship, but also need RELIFE solder paste.
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