Model : Supported Ic’s
MSM8974-8274-8674 CPU –3S NOTE
₹270.00 ₹300.00
Model : Supported Ic’s
MSM8974-8274-8674 CPU –3S NOTE
BGA-IC Adhesive Remove Liquid, High-effect
For the mobile phone BGA/IC Resin sealant
Softened and removed, Scientific formula
Does not hurt the Motherboard or Component
RL-039 can quickly soften Resin
DZKJ PhoneRepair Tools 1 Year 3 User
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TFM Tool Pro Activation (1 YEAR)
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EFT Pro Tool No need Dongle 1 Year Plan
Processing time : 1-5 Miniutes
Infinity – Box / Dongle 1 Year Updates / Support Renew, Chinese Miracle -2
————————————————————————————————————Price / Log — Delivery Time 10-20 Mins Instant
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