Borneo Schematics 1 User/3 Month Plan (New User)
Borneo Schematics 1 User/3 Month Plan (New User)
₹1,370.00 ₹1,800.00
Price Summary
- ₹1,800.00
- ₹1,370.00
- 24%
- ₹1,370.00
- Overall you save ₹430.00 (24%) on this product
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Borneo Schematics 2 User/1 Year Plan (New User)
Features :
Bitmap PCB Viewer
Hardware Solutions
Pdf Official Schematics
1 Login can use for 2 pcs at the same time
Borneo Schematics 2 Users Renewal Code
Borneo Schematics 2 Users Renewal Code
Processing time : 1-5 Miniutes
Borneo Schematics 1 User/1 Year plan (New User)
Bitmap PCB Viewer
Hardware Solutions
Pdf Official Schematics
1 Login can use for 1 pc at One Time
Borneo Schematics 1 Users Renewal Code
Borneo Schematics 1 Users Renewal Code
Processing time : 1-5 Miniutes
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Octoplus FRP Tool Dongle
Octoplus FRP Tool allows you to reset Google Factory Reset Protection (FRP) for Samsung, Huawei, LG, Alcatel, Motorola cell phones.
Samsung Reset FRP operations.
1. “Reset FRP UART (UFS chips)” operation. This operation will not reset/delete device user data.
2. “Reset FRP ADB (Combination)” operation. This operation will not reset/delete device user data.
3. “Reset FRP (Download Mode)” operation. Be careful, performing this operation will delete all user data (contacts, pictures and other) from the device!
4. Reset FRP UART (eMMC chips) operation. This operation will not reset/delete user data on the device.
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WUXINJI 1 Year VIP Card Activation Key Instant
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B&R X4301 CPU OPENER BLADE 43 IN 1
– Proffesional Repair Toolkit for Iphone CPU disassembly
– For BGA repair, dismantle phone CPU chip and repair phone
– One handle & 43 blades in different shapes
– Handle Material: Titanium Alloy
MobileSea Service Tool Activation
MRT Dongle + Gsm Multi Functional Cable Full Set (Combo Offer)
Special Combo offer
Package includes:
1 x MRT Key + 1 x Gsm Multi Functional Cable full Set
The MRT-dongle is a Mobile Software Repair Tool for Android Mobile Phone
Mechanic BGA IC Adhesive Removing Liquid (Mechanic QC-20)
- 20ml BGA IC glue epoxy remover.
- Can help you soften & remove resinating/sealing glue of chip BGA IC of mobile phones easily.
- Can quickly soften and loosen solidified resin adhesive such as epoxy, phenolics, acrylate, polyurethane, organosilicon, etc.
- It won’t do harm to your circuit board and components.
- Environment friendly and safe. Doesn’t contain any Benzene Coderivative substances with cause leukemia.
MRT Dongle + Mobile Software Course Vol- 1
Special Combo offer
Package includes:
1 x MRT Dongle + 1 x Mobile Software Course Vol- 1
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