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(Showing 37 – 48 products of 53 products)

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RELIFE RL-039 BGA-IC GLUE REMOVE LIQUID

Highlights:

BGA-IC Adhesive Remove Liquid, High-effect
For the mobile phone BGA/IC Resin sealant
Softened and removed, Scientific formula
Does not hurt the Motherboard or Component
RL-039 can quickly soften Resin

Relife Rl-058 3 In 1 Chip Welding Equipments Solder Set

Highlights:

RL-058 3 in 1 chip welding special set
. A set to solve the problem of chip soldering
.tube type BGA solder paste,Contains imported flux for better soldering effect

RELIFE RL-223-OR Solder Paste 100g

Highlights:
  • Designed for soldering and reballing BGA, PGA and SMD components on phone mainboards.
  • Lead free and no residue.
  • Features high viscosity and high activity.
  • Provides quick and high-quality tinning with a minimum amount of smoke.

Sunshine Digital Multi-Meter DT 9205E

Highlights:
Place of Origin:
Guangdong, China (Mainland)
Brand Name:
SUNSHINE
Model Number:
DT-9205E

Sunshine SL-908 Soldering Iron (60W)

Highlights:

Color:White/Black

Input voltage:110/220V

Power:60W

Temperature range:250-450℃

Dimentions:220MM

Handle:Plastic

UFI ISP Adapter V2 For UFI-Box

Highlights:
UFI ISP Adapter V2 for UFI Box.  UFI Box is a powerful EMMC Service Tool that can Read EMMC user data, as well as repair, resize, format, erase, read write and update the firmware on EMMC in Samsung, China phone SK Hynix, Toshiba, Kingston, micron, and other brands.

Package include:
1 x UFI ISP Adapter V2

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