RELIFE RL-101H Main Board Middle Layer Layered Special Blade For Mobile Phone Motherboard Chip Repair Bevel Layered Blade


RELIFE RL-101H MIDDLE LAYERED SPECIAL BLADE SET
₹199.00 ₹300.00
Price Summary
- ₹300.00
- ₹199.00
- 34%
- ₹199.00
- Overall you save ₹101.00 (34%) on this product
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RELIFE RL-422 IM SOLDER FLUX PASTE (LEAD-FREE)
1. Imported rosin from Japan, environmentally , lead-free and halogen-free, with high safety.
2. Strong activity, good viscosity, good fluidity and easier tinning.
3. Milky white paste, no residue, fast tinning.
4. High insulation resistance, suitable for mobile phone motherboards, cpu repair, etc.
CE – ROHS – FCC – ISO 9001-2008
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