MTK MT Power Black Stencil (MEGA-IDEA)
MTK MT Power Black Stencil (MEGA-IDEA)
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Martview RB-02 7in1 CPU Reballing Stencil Full Set
₹2,199.00 ₹4,000.00
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- ₹400.00
- ₹350.00
- 13%
- ₹350.00
- Overall you save ₹50.00 (13%) on this product
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Martview RB-01 Reballing Stencil Full Set
Highlights:
- Support for EMMC EMCP UFS BGA153 BGA162 BGA169 BGA186 BGA221 BGA254
- Stencil net thickness: 0.15mm
- Holder size: 80*80*15mm
- Packing size: 89*89*32mm
₹2,550.00 ₹2,850.00
SamKey Existing User (20 Credit Pack)
Highlights:
Note: when you creat user please dont use CAPITAL words else account will not
Samsung Phones Drviers
*************************************************************************
https://www.dropbox.com/s/wfk4q2wx3t6wm2e/SAMSUNG_USB.exe?dl=0
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https://www.dropbox.com/s/2slvi8fzwz8shrw/SamKEY1502.exe?dl=0
************************************************************************
₹2,550.00 ₹3,200.00
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Mechanic BGA IC Adhesive Removing Liquid (Mechanic QC-20)
Highlights:
- 20ml BGA IC glue epoxy remover.
- Can help you soften & remove resinating/sealing glue of chip BGA IC of mobile phones easily.
- Can quickly soften and loosen solidified resin adhesive such as epoxy, phenolics, acrylate, polyurethane, organosilicon, etc.
- It won’t do harm to your circuit board and components.
- Environment friendly and safe. Doesn’t contain any Benzene Coderivative substances with cause leukemia.
₹350.00 ₹450.00
Crowbar SW-103 Cpu Degumming Crowbar
Highlights:
5 in 1 IC BGA Chip Repair Kit with Handle for iPhone Motherboard CPU Remover Glue Cleaning Mobile Phone Repair Tools
Size: 161mm
Proffesional repair tool set for iPhone CPU disassemble. For BGA repair,dismantling phone CPU chip and phone repair. It can be used to separate the welding spot.
₹170.00 ₹280.00
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