Name: MTK MT Power Black Stencil (MEGA-IDEA)
SKU: 2459
Price: 350.00 INR
Availability: InStock

MTK MT Power Black Stencil (MEGA-IDEA)

₹350.00

13% Off

Price Summary

Maximum Retail Price
(incl. of all taxes) ₹400.00
Selling Price ₹350.00
Discount 13%
Total ₹350.00
Overall you save ₹50.00 (13%) on this product

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Octoplus FRP Tool Dongle

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Octoplus FRP Tool allows you to reset Google Factory Reset Protection (FRP) for Samsung, Huawei, LG, Alcatel, Motorola cell phones.

Samsung Reset FRP operations.

1. “Reset FRP UART (UFS chips)” operation. This operation will not reset/delete device user data.

2. “Reset FRP ADB (Combination)” operation. This operation will not reset/delete device user data.

3. “Reset FRP (Download Mode)” operation. Be careful, performing this operation will delete all user data (contacts, pictures and other) from the device!

4. Reset FRP UART (eMMC chips) operation. This operation will not reset/delete user data on the device.

More Info Please Check Description

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Activations & Credits, NCK Activations, NCk Dongle Activation ( yearly)

NCK Pro Dongle Activation

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Card active!. 1 Year activation active Use NCK Dongle v15.6 or above version When Activation msg display, UPDATE Card/Dongle Restart Software Now you can use all new modules.

Note: Please update card first using NCK Dongle Main Module v18.8 if card is updated security OK then submit NCK activation, If Card not update security then DO NOT SUBMIT

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MTK MT Power Black Stencil (MEGA-IDEA)

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Box & Dongles, NCK Pro Dongle

NCK Pro Dongle (UMT+Nck)

Highlights:

UMT+Nck Pro Dongle (2 in 1 Dongle)

Huawei with old and new security types
The standalone solution doesn’t need any server codes or credits
All firmware versions and provider IDs are supported
Fast unlock procedure
Reset User Code.

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Activations & Credits, DFT Pro, DFT Pro Tool 1 Year - Renewal

DFT PRO Tool 1 Year –RENEWAL

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DFT PRO Tool 1 Year – RENEWAL

1-5 HOURS DELIVERY TIME

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Mechanic BGA IC Adhesive Removing Liquid

Mechanic BGA IC Adhesive Removing Liquid (Mechanic QC-20)

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20ml BGA IC glue epoxy remover.

Can help you soften & remove resinating/sealing glue of chip BGA IC of mobile phones easily.

Can quickly soften and loosen solidified resin adhesive such as epoxy, phenolics, acrylate, polyurethane, organosilicon, etc.

It won’t do harm to your circuit board and components.

Environment friendly and safe. Doesn’t contain any Benzene Coderivative substances with cause leukemia.

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All Cables for Mobile, IBoot Power Supply Cable

IBoot Power Supply Box Test Tools

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Feature

Applicable to Android phones , Support Huawei , Samsung , Xiaomi , Glory , OPPO, VIVO , Meizu Red Rice , ZTE , LG, Mito, LeTv, Lenovo , Hisense< ACRE Nubia , Nokia , one Plus, Jinli, Cool, Sony , HTC , Blackberry and Meny Mor
Boot Port adopts 16 PCS Cable Buckle Designs, Supply for Widely Cell Phone
The Battery Base Match the Cable buckles Corresponding, it can be use
Overcurrent Protection, When the Current Over 3A , the pratection function automatically
The inputVoltage Over 4.8v, it will be automatically disconnect to prevent the phone from burning out