Model : Supported Ic’s
MSM8998 CPU-
₹270.00 ₹300.00
Model : Supported Ic’s
MSM8998 CPU-
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EME Mobile Tools Download Link –
http://www.emegsm.com/en/software.asp
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EME Mobile Tools Supported Modal –
https://www.martview-forum.com/thread…
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BGA-IC Adhesive Remove Liquid, High-effect
For the mobile phone BGA/IC Resin sealant
Softened and removed, Scientific formula
Does not hurt the Motherboard or Component
RL-039 can quickly soften Resin
Package include:
1 x UFI Box
1 x UFI-Lite USB3.0 SuperSpeed uSD/eMMC Reader
1 x 2 In 1 eMMC/eMCP socket (169-FBGA,153-FBGA,162-FBGA,186-FBGA)
1 x BGA221 / BGA254 2in1 eMMC/eMCP socket
1 x UFI ISP Adapter V2
1 x USB Data Cable
1 x USB to DC 5V External Power cable
MobileSea Service Tool 10 Credit Pack
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1-5 MINIUTES DELIVERY TIME
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