Model : Supported Ic’s
MSM8998 CPU-
₹270.00 ₹300.00
Model : Supported Ic’s
MSM8998 CPU-
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1. Clean the parts to be joined.
2. Clean soldering iron tip and tin all faces of tip with coating of solder
3. Heat parts (not solder) to be joined
4. Apply flux-core solder to heated parts, not the soldering tip, and heat it till solder melts and flows freely.
This is Normal 1 year activation to use all modules but not related to HUAWEI Module.
For Huawei module you must purchase it on its own and it is unlimited = no yearly activation needed
BGA-IC Adhesive Remove Liquid, High-effect
For the mobile phone BGA/IC Resin sealant
Softened and removed, Scientific formula
Does not hurt the Motherboard or Component
RL-039Â can quickly soften Resin
1 Pack = 10 Credits
– Now 1 Auth needs 10 Credits
– There will be NO refund in any case so make sure you really need to use it.
– Old QcFire 4.x can not connect to new server anymore
– Check forum for reports on your model before doing anything with credits
– Mi Account relock CAN NOT be fixed with Mi Auth Credits.
Please Register First and then Enter User Name for Activation
Please Register Here – https://unlocktool.net/register/
Guide Videos Link – https://unlocktool.net/blog/
Download Link – https://unlocktool.net/download/
Special Combo offerÂ
Package includes:
1 x UMT Pro Dongle V2 + 1 x Mobile Software Course Vol- 1
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