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Mechanic BGA IC Adhesive Removing Liquid (Mechanic QC-20)
Highlights:
- 20ml BGA IC glue epoxy remover.
- Can help you soften & remove resinating/sealing glue of chip BGA IC of mobile phones easily.
- Can quickly soften and loosen solidified resin adhesive such as epoxy, phenolics, acrylate, polyurethane, organosilicon, etc.
- It won’t do harm to your circuit board and components.
- Environment friendly and safe. Doesn’t contain any Benzene Coderivative substances with cause leukemia.
₹350.00 ₹450.00
EME Mobile Tools (EMT)
Highlights:
EME Mobile Tools Download Link –
http://www.emegsm.com/en/software.asp
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EME Mobile Tools Supported Modal –
https://www.martview-forum.com/thread…
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₹4,300.00 ₹5,200.00
₹270.00 ₹300.00
₹270.00 ₹300.00