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Mechanic BGA IC Adhesive Removing Liquid (Mechanic QC-20)
Highlights:
- 20ml BGA IC glue epoxy remover.
- Can help you soften & remove resinating/sealing glue of chip BGA IC of mobile phones easily.
- Can quickly soften and loosen solidified resin adhesive such as epoxy, phenolics, acrylate, polyurethane, organosilicon, etc.
- It won’t do harm to your circuit board and components.
- Environment friendly and safe. Doesn’t contain any Benzene Coderivative substances with cause leukemia.
₹350.00 ₹450.00
₹270.00 ₹300.00
SUNSHINE SS-007D Iphone PCB Fingerprint Repair Jump Wire 150M/0.01MM
Highlights:
1. with ultra-fine diameter of 0.01MM, precise connection, ensure there is no short-circuit
between 0.1mm solder joints, totally beat handset cable.
2. can be stretched, used really bare copper.
3. Insulate,anti-short circuit.
4. High efficiency, high noise immunity
5. With environmental vacuum packaging
6. Make sure that the solder point is aligned with the jump wire.
₹340.00 ₹550.00
₹270.00 ₹300.00